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      • BOE MLED COB

        Compared with traditional products equipped with front-loaded chips, BOE COB products with RGB full flip chip technology continue to improve the transmittance rate of the black film encapsulation program. It has more outstanding performance due to high protection and high reliability.

        • BOE MLED COB

        • BOE MLED COB

        • BOE MLED COB

      • Product Highlights

      • Cases

      • Product Parameters

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      Product Highlights

      • RGB full flip

        Reduce cost and improve quality

      • Thin Package

        Thinner<250um

      • Black film package

        Continue to improve picture quality

      • Common cathode drive

        Better experience closer to the screen

      • High protection and high reliability

        Reduce transport and maintenance risks

      • Power/Dual-Link solution

        Major projects are guaranteed

      • Overseas qualification

        Products are available for sale overseas

      • Curved splicing

        Enable multiple scenarios

      Product Parameters

      BYH-COB
      Specifications BYH009 Ultra BYH009V1 BYH012V1 BYH015V1
      Pitch 0.9375 0.9375 1.25 1.5
      Module Size（mm） 150*337.5 150*168.75
      Cabinet Dimension（mm） 600*337.5 600*337.5
      Maintenance Mode Front
      Cabinet flatness（mm） ≤0.1
      White balance brightness（cd/m2） Typ 1500 Typ 600, 0 - 800 Adjustable
      Refresh Rate（Hz） 7680 3840
      Installation mode Stacking & Wall mounting

      * Please click on the bottom of the project for more product details.

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